Superconducting multilayer structures with a thick SiO2 dielectric interlayer for multichip modules

Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials

Volumn 2, Issue , 2000, Pages 1023-1025

  Zhang, G O ^a   Yao, H J ^a   Luo, W A ^a   Ang, S S ^a   Brown, W D ^a   Chan, F T ^a   Salamo, G I ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; INTEGRATED CIRCUITS; ION BEAM ASSISTED DEPOSITION; MULTICHIP MODULES; SEMICONDUCTOR DEVICE MANUFACTURE; YTTRIUM BARIUM COPPER OXIDES; ZIRCONIA;

CLOCK DISTRIBUTION CIRCUIT; REACTIVE SPUTTERING TECHNIQUE;

HIGH TEMPERATURE SUPERCONDUCTORS;

EID: 0034508925     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)