On the high-frequency characteristics of substrate resistance in RF MOSFETs

IEEE Electron Device Letters

Volumn 21, Issue 12, 2000, Pages 604-606

  Cheng, Yuhua ^a   Matloubian, Mishel ^a  

^a Rockwell Semiconductor Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRIC ADMITTANCE; ELECTRIC RESISTANCE; SUBSTRATES;

DEVICE MODELING; HIGH-FREQUENCY CHARACTERISTICS;

MOSFET DEVICES;

EID: 0034499762     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/55.887480     Document Type: Article

References (9)

1. W. Liu et al., "R. F. MOSFET modeling accounting for distributed substrate and channel resistances with emphasis on the BSIM3v3 SPICE model," in IEDM Tech. Dig., 1997, pp. 309-312.
2. Y. Cheng et al., "RF Modeling issues of deep-submicron MOSFET's for circuit design," in Proc. I EEE Int. Conf. Solid-State and Integrated Circuit Technology, Oct. 1998, pp. 416-419.
3. S. H. Jen et al., "Accurate modeling and parameter extraction for MOS transistor valid up to 10 GHz," IEEE Trans. Electron Devices, vol. 46, pp. 2217-2227, 1999.
4. D. Pehlke et al., "High frequency application of MOS compact models and their development for scalable RF model libraries," in Proc. IEEE Custom Integrated Circuit Conf., May 1998, pp. 219-222.
5. J. Ou et al., "CMOS RF Modeling for GHz Communication IC's," in Symp. VLSI Technology Dig. Tech. Papers, June 1998, pp. 94-95.
6. S. Fong Tin and K. Mayaram, "Substrate network modeling for CMOS RF circuit simulation," in Proc. IEEE Custom Integrated Circuit Conf., May 1999, pp. 583-586.
7. M. Rancanelli et al., "BC35-a 0.35 μm BICMOS technology for RFIC," in Proc. MTT, Anaheim, CA, June 1999.
8. M. C. A. M. Koolen, J. A. M. Geelen, and M. P. J. G. Verleijen, "An improved de-embedding technique for on-wafer high-frequency characterization," in IEEE Proc. Bipolar Circuit and Technology Meeting, 1991, pp. 188-191.
9. C. Enz and Y. Cheng, "MOS Transistor modeling for RF IC design," IEEE J. Solid-State Circuits, vol. 35, pp. 186-201, 2000.