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Volumn 40, Issue 12, 2000, Pages 2471-2481

Simulation of the non-isothermal resin transfer molding process

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; CONSOLIDATION; HEAT CONDUCTION; HEAT CONVECTION; MATHEMATICAL MODELS; PLASTIC MOLDS; POROUS MATERIALS; RESIN TRANSFER MOLDING; RHEOLOGY; THERMAL EFFECTS;

EID: 0034485746     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.11378     Document Type: Article
Times cited : (20)

References (16)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.