Application of HITCE ceramic material for LGA-type chip scale package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 358-363

  Maeda, Kazutaka ^a   Higashi, Masahiko ^a   Kokubu, Masanai ^a   Nakagawa, Shoichi ^a  

^a KYOCERA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; ELASTIC MODULI; FINITE ELEMENT METHOD; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; STRAIN; THERMAL CYCLING;

BALL GRID ARRAY; HIGH THERMAL COEFFICIENT OF EXPANSION; LAND GRID ARRAY; TEMPERATURE CYCLING TEST;

CHIP SCALE PACKAGES;

EID: 0034483651     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)