MEMS sensor multi-chip module assembly with TAB carrier-pressure belt for aircraft flight testing

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 689-696

  Kim, Namsoo P ^a   Holland, Mark J ^a   Tanielian, Minas H ^a   Poff, Ron ^a  

^a BOEING COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIRCRAFT; BELTS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MULTICHIP MODULES; RELIABILITY; SENSORS;

AIRCRAFT FLIGHT TESTING; ELECTRONIC ASSEMBLY; INTERCONNECTION METHODS; PRESSURE BELT; TAPE AUTOMATED BONDING CARRIER;

MICROELECTROMECHANICAL DEVICES;

EID: 0034482893     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)