Solder joint shape formation under constrained boundaries in wafer level underfill

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1320-1325

  Nguyen, L ^a   Nguyen, H ^a  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; CURING; DEPOSITION; EPOXY RESINS; FLIP CHIP DEVICES; INTEGRAL EQUATIONS; ITERATIVE METHODS; SOLDERED JOINTS; SURFACE TENSION;

GRADIENT DESCENT METHOD; SOLDER BALLS; SOLDER WETTABILITY; SURFACE EVOLVER; WAFER LEVEL DEPOSITION; WAFER LEVEL UNDERFILLING;

ELECTRONICS PACKAGING;

EID: 0034482685     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)