Sacrificial metal wafer level burn-in KGD

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 535-540

  Ivy, Wilburn L ^a   Godavarti, Prasad ^a   Alizy, Nouri ^a   McKenzie, Teresa ^a   Mitchell, Doug ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; DESIGN FOR TESTABILITY; ELECTRIC PROPERTIES; RELIABILITY; TECHNOLOGICAL FORECASTING;

KNOWN GOOD DIE; SACRIFICIAL METAL WAFER LEVEL BURN-IN; STRATEGIC ENABLING TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 0034482526     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)