Reducing device yield fallout at wafer level test with electrohydrodynamic (EHD) cleaning

IEEE International Test Conference (TC)

Volumn , Issue , 2000, Pages 477-484

  Broz, Jerry J ^a   Andersen, James C ^b   Rincon, Reynaldo M ^a  

^a TEXAS INSTRUMENTS   (United States)

^b Applied Precision Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASION; CLEANING; CONTACT ANGLE; DEFECTS; ELECTRODYNAMICS; FAILURE ANALYSIS; HYDRODYNAMICS; IMPURITIES; INTEGRATED CIRCUIT MANUFACTURE; MOLECULES; SILICON WAFERS; TUNGSTEN CARBIDE;

CONTACT RESISTANCE; DEVICE YIELD FALLOUT; ELECTROHYDODYNAMIC CLEANING; OFFLINE ABARASIVE CLEANING; PROBE CARD;

INTEGRATED CIRCUIT TESTING;

EID: 0034482514     PISSN: 10893539     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEST.2000.894240     Document Type: Article

References (15)

1. M. Schell J. Sanders Microelec. Manuf. and Testing 9 1984
2. R. LaRosa S. Griffing Microelec. Manuf. and Testing 9 1989
3. J.J. Broz R.M. Rincon EE-Eval. Eng. 9 1999
4. J.K. Logan EE-Eval. Eng. 8 1985
5. J.J. Broz R.M. Rincon Proc. IEEE-Int. Test Conf Proc. IEEE-Int. Test Conf 1999
6. J.G. Zhang X.M. Wen IEEE Trans. Com., Hyb., Manuf. Technol. CHMT-9 1986
7. J.J. Broz R. Rincon IEEE Proc. Southwest Test Workshop IEEE Proc. Southwest Test Workshop 1998
8. J.C. Andersen IEEE Proc. of the Southwest Test Workshop IEEE Proc. of the Southwest Test Workshop 1998
9. J.F. Mahoney Solid State Tech. 7 1998
10. J.F. Mahoney Proc. 28th Ann. Meeting Fine Part. Soc. Proc. 28th Ann. Meeting Fine Part. Soc. 1998
11. J.C. Andersen IEEE Proc. of the Southwest Test Workshop IEEE Proc. of the Southwest Test Workshop 1999
12. R. Holm Electric Contacts 1967 Springer-Verlag
13. M. Runde IEEE Trans. Comp. Hyb., Manuf. Technol. CHMT-9 1986
14. J.F. Mahoney Int. J. Mass Spec. and Ion Proc. 174 1998
15. J.F. Mahoney Amer. Soc. for Mass Spec. 3 1992