Advanced packaging technologies in MOSFETs for power management

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 147-150

  Tsui, Anthony ^a   Sarkis, Jingo ^a   Chen, Howard ^a  

^a Vishay   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; POWER SUPPLY CIRCUITS; SILICON; SURFACE MOUNT TECHNOLOGY;

MINITURIZATION; POWER CONVERSION CIRCUITS; POWER MANAGEMENT; SURFACE MOUNT POWER PACKAGES;

MOSFET DEVICES;

EID: 0034480251     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)