Module packaging for high-speed serial and parallel transmission

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 479-486

  Karstensen, Holger ^a   Auracher, Franz ^b   Ebel, Norbert ^a   Fiedler, Jens ^a   Plickert, Volker ^a   Melchior, Lutz ^a   Leininger, Lars ^a   Bittner, Manfred ^a   Festag, Mario ^a   Wicke, Markus ^a   Meyer, Stephan ^c   Miller, Roger ^c   Kuhn, Gerhard ^a   Althaus, Hans Ludwig ^a   Ebberg, Alfred ^b  

^a Fiber Optics   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

^c Infineon Technology Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; BANDWIDTH; DATA COMMUNICATION SYSTEMS; OPTOELECTRONIC DEVICES; PRINTED CIRCUIT BOARDS; WAVELENGTH DIVISION MULTIPLEXING;

HIGH SPEED SERIAL; MODULE PACKAGING; OPTOELECTRONIC MODULES; PARALLEL TRANSMISSION;

ELECTRONICS PACKAGING;

EID: 0034476472     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)