Packaging-compatible microtransformers on a silicon substrate

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 206-210

  Park, Jae Y ^a   Hong, Hyung K ^a   Bu, Jong U ^a  

^a LG   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONVERTERS; ELECTRIC CURRENTS; ELECTROPLATING; LOW TEMPERATURE OPERATIONS; MAGNETIC CORES; MULTICHIP MODULES; SENSORS; SURFACE MOUNT TECHNOLOGY;

ELECTROPLATED THICK PERMALLOY CORES; MICROTRANSFORMERS; SURFACE MICROMACHINING TECHNIQUES;

ELECTRONICS PACKAGING;

EID: 0034476469     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)