Flip chip design rule development for multiple signal and ground bump configurations

Asia-Pacific Microwave Conference Proceedings, APMC

Volumn , Issue , 2000, Pages 5-

  Staiculescu, Daniela ^a   Laskar, Joy ^a   Tentzeris, Manos ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC GROUNDING; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MICROWAVE INTEGRATED CIRCUITS; STATISTICAL METHODS; TRANSMISSION LINE THEORY; WAVEGUIDES;

GROUND BUMPS; MULTIPLE SIGNAL;

INTEGRATED CIRCUIT LAYOUT;

EID: 0034462277     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)