WNx film deposition by PECVD using WF6/N2/H2 gas mixture

Advanced Metallization Conference (AMC)

Volumn , Issue , 2000, Pages 301-306

  Richter, Kristin ^a   Riedel, S ^a   Schulz, S E ^a   Gessner, T ^a  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COMPOSITION; CRYSTAL MICROSTRUCTURE; DIFFUSION; ELECTRIC CONDUCTIVITY; FILM PREPARATION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; TUNGSTEN COMPOUNDS;

DIFFUSION BARRIERS;

AMORPHOUS FILMS;

EID: 0034459195     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Advanced metallization conference in 1999