Low operation voltage high integrated field emitter arrays by Transfer Metal Mold technique using ultra precision machining and super microelectroplating technology

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 2000, Pages 423-426

  Nakamoto, M ^a   Fukuda, K ^a   Inoue, A ^a   Takahashi, F ^a   Honda, S ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POTENTIAL; ELECTROPLATING; MACHINING; MICROELECTRONICS;

FIELD EMITTER ARRAYS (FEA); TRANSFER METAL MOLD TECHNIQUES;

ELECTRON SOURCES;

EID: 0034453897     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Uniform, stable and high integrated field emitter arrays for high performance displays and vacuum microelectronic switching
2. Fabrication of field emitter arrays by transfer mold technique