The advent of 3-D package age

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2000, Pages 102-107

  Wu, Larry ^a   Wang, Yu Po ^a   Kee, S C ^b   Wallace, Bob ^b   Hsiao, C S ^a   Yeh, C K ^a   Her, T D ^a   Lo, Randy ^a  

^a Siliconware Precision Industries Co Ltd   (China)

^b SanDisk Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CONSUMER PRODUCTS; FINITE ELEMENT METHOD; FLASH MEMORY; STATIC RANDOM ACCESS STORAGE; TECHNOLOGICAL FORECASTING; THERMAL CONDUCTIVITY; THREE DIMENSIONAL; WIRELESS TELECOMMUNICATION SYSTEMS;

MULTI-DIE PACKAGE; MULTI-MEDIA CARD; SOFTWARE PACKAGE ANSYS; THIN AND FINE PITCH BALL GRID ARRAY; THREE DIMENSIONAL PACKAGE;

ELECTRONICS PACKAGING;

EID: 0034447549     PISSN: 10898190     EISSN: None     Source Type: Journal    
DOI: 10.1109/IEMT.2000.910714     Document Type: Article

References (5)

1. Characterization of a novel fine-pitch ball grid array package for flash memory applications
2. Reliability evaluation of chip scale packages
3. Stacked CSP/A solution for system LSI
4. Triple-chip stacked CSP
5. Wafer sawing/grinding process