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Volumn 16, Issue 4, 2000, Pages 442-450
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Temperature changes during hot plane strain compression testing
a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
ARTICLE;
COMPRESSION;
COMPUTER;
MATERIALS TESTING;
MODEL;
PHYSICAL STRESS;
TEMPERATURE;
TIME;
ULTRASTRUCTURE;
VALIDATION PROCESS;
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EID: 0034443412
PISSN: 02670836
EISSN: None
Source Type: Journal
DOI: 10.1179/026708300101507893 Document Type: Article |
Times cited : (27)
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References (11)
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