Automated fabrication of ceramic electronic packages by stereo-photolithography

Materials Research Society Symposium - Proceedings

Volumn 625, Issue , 2000, Pages 173-178

  Zimbeck, W R ^a   Jang, J H ^b   Schulze, W ^b   Rice, R W ^c  

^a Technology Assessment and Transfer Inc   (United States)

^b ALFRED UNIVERSITY   (United States)

^c NONE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; FABRICATION; MULTILAYERS; PHOTOLITHOGRAPHY; RHEOLOGY; SCREEN PRINTING; SINTERING; THICK FILMS;

AUTOMATED FABRICATION; BREADBOARD PROCESSING SYSTEM; CERAMIC ELECTRONIC PACKAGES; STEREOPHOTOLITHOGRAPHY;

ELECTRONICS PACKAGING;

EID: 0034442916     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: 10.1557/PROC-625-173     Document Type: Article

References (0)