Electromigration-induced stress interaction between via and polygranular cluster

Materials Research Society Symposium-Proceedings

Volumn 612, Issue , 2000, Pages D8111-D8116

  Park, Young Joon ^a   Choi, In Suk ^b   Joo, Young Chang ^b  

^a Korea Institute of Science and Technology   (South Korea)

^b Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; COMPUTER SIMULATION; CURRENT DENSITY; STRESS ANALYSIS; TENSILE STRESS;

POLYGRANULAR CLUSTERS;

ELECTROMIGRATION;

EID: 0034431066     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: 10.1557/proc-612-d8.11.1     Document Type: Article

References (8)