SCOPUS 정보 검색 플랫폼

Materials Research Society Symposium - Proceedings

Volumn 612, Issue , 2000, Pages

The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects

(2) Hau Riege, S P a Thompson, C V a

a Massachusetts Institute of Technology Cambridge (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; ELECTROMIGRATION; METALLIZING; NUCLEATION; STRAIN; STRESS ANALYSIS; TENSILE STRESS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; PERMITTIVITY;

METALLIC INTERCONNECTS;

DIELECTRIC MATERIALS;

METALLIC INTERCONNECTS;

EID: 0034431036 PISSN: 02729172 EISSN: None Source Type: Conference Proceeding
DOI: 10.1557/proc-612-d10.2.1 Document Type: Conference Paper

Times cited : (5)

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2
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- Eshelby, J.D.¹

4
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- Waeterloos, J.¹ Simmonds, M.² Achen, A.³ Meier, M.⁴

7
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- Hibbit, Karlson, and Sorensen, Inc., Pawtucket
- (1998) Abaqus, Version 5.8, general purpose finite element program

8
- 0003610580
- J. Mat. Res.
- Hau-Riege, S.P.¹ Thompson, C.V.²

9
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- Springer Verlag, New York, NY
- (1987) Residual Stress
- Noyan, I.C.¹ Cohen, J.B.²

10
- 0000160317
- (1999) J. Appl. Phys. , vol.85 , pp. 3546
- Park, Y.-J.¹ Andleigh, V.K.² Thompson, C.V.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.