SCOPUS 정보 검색 플랫폼 - 논문 보기

메뉴 건너뛰기

Materials Research Society Symposium-Proceedings

Volumn 612, Issue , 2000, Pages D911-D917

Trench and via filling with electroplated copper: Effect of current density and pulse waveform

(5) Seah, C H a Mridha, S b Siew, Y K b Sarkar, G b Chan, L H c

a Thin Film Department (Singapore)

b NANYANG TECHNOLOGICAL UNIVERSITY (Singapore)

c CHARTERED SEMICONDUCTOR MANUFACTURING LTD (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COALESCENCE; CURRENT DENSITY; DEPOSITION; ELECTROPLATING; GRAIN GROWTH; WAVEFORM ANALYSIS;

ELECTROPLATED COPPER;

COPPER PLATING;

EID: 0034428419 PISSN: 02729172 EISSN: None Source Type: Journal
DOI: 10.1557/proc-612-d9.1.1 Document Type: Article

Times cited : (3)

References (12)

1
- 0000536492
- (1997) Proc. IEDM Conf. , pp. 769
- Venkatesan, S.¹

2
- 0000784255
- (1997) Proc. IEDM Conf. , pp. 773
- Edelstein, D.¹

3
- 0000205834
- (1995) VMIC , vol.12 , pp. 322
- Contolini, R.J.¹ Tarte, L.² Graft, R.T.³ Evans, L.B.⁴ Cox, J.N.⁵ Puich, M.R.⁶ Gee, J.D.⁷ Mu, X.-C.⁸ Chiang, C.⁹

4
- 0001852987
- (1997) VMIC , vol.14 , pp. 69
- Dubin, V.M.¹ Ting, C.H.² Cheung, R.³

5
- 0038612775
- (1998) IITC , vol.1 , pp. 151
- Heidenreich, J.¹

6
- 0001316289
- (1998) IITC , vol.1 , pp. 154
- Blaschke, V.¹

7
- 0001312680
- (1998) IITC , vol.1 , pp. 166
- Ritzdorf, T.¹ Graham, L.² Jin, S.³ Mu, C.⁴ Fraser, D.⁵

8
- 0004019060
- McGraw-Hill
- (1989) Principles of Electronics Packaging
- Seraphim, D.P.¹ Lasky, R.² Li, C.Y.³

9
- 85009862297
- MRS
- (1999) Adv. Metallization Conf. in 1998 , pp. 29
- Andricacos, P.C.¹ Uzoh, C.² Dukovic, J.O.³ Horkans, J.⁴ Deligianni, H.⁵

10
- 0003725315
- MRS
- (1999) Adv. Metallization Conf. in 1998 , pp. 35
- Lopatin, S.¹

11
- 0001444686
- (1999) IITC , vol.2 , pp. 284
- Reid, J.¹

12
- 0001426626
- (1998) IITC , vol.1 , pp. 157
- Seah, C.H.¹ Mridha, S.² Chan, L.H.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.