Etching characteristics of fine Ta patterns with electron cyclotron resonance chlorine plasma

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 39, Issue 12 B, 2000, Pages 6996-6999

  Woo, Sang Gyun ^a   Kim, Sang Hoon ^a   Ju, Sup Youl ^a   Son, Joo Hiuk ^b   Ahn, Jinho ^a  

^a Hanyang University   (South Korea)

^b University of Seoul   (South Korea)

Author keywords

Actinometry; Double step etching; Microloading effect; Plasma etching; Tantalum

Indexed keywords

CHLORINE; DESORPTION; ELECTRON CYCLOTRON RESONANCE; ION BOMBARDMENT; SPUTTERING; TANTALUM;

CHEMICAL-REACTION-DOMINANT PROCESS; DOUBLE STEP ETCHING; MICROLOADING EFFECTS;

PLASMA ETCHING;

EID: 0034427357     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.39.6996     Document Type: Article

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