Miniaturized millimeter-wave hybrid IC technology using non-photosensitive multi-layered BCB thin films and stud bump bonding

IEICE Transactions on Electronics

Volumn E83-C, Issue 11, 2000, Pages 2029-2037

  Takahashi, Kazuaki ^a   Ogura, Hiroshi ^a   Sagawa, Morikazu ^a  

^a Matsushita Research Institute Tokyo Inc   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BENZOCYCLOBUTENE THIN FILM; MICROBUMP; MILLIMETER WAVE FLIP CHIP INTEGRATED CIRCUIT; STUD BUMP BONDING;

BONDING; CAPACITORS; DIELECTRIC MATERIALS; MILLIMETER WAVE DEVICES; MIM DEVICES; MULTICHIP MODULES; MULTILAYERS; SUBSTRATES; THIN FILMS; TRANSMISSION LINE THEORY;

FLIP CHIP DEVICES;

EID: 0034326129     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (23)