Investigation of aluminum-indium alloys for interconnect applications

Journal of the Electrochemical Society

Volumn 147, Issue 11, 2000, Pages 4318-4323

  Kailasam, Sridhar K ^a,b   Murarka, Shyam P ^a   Glicksman, Martin E ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b NOVELLUS SYSTEMS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; DIFFUSION IN SOLIDS; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTROMIGRATION; ELECTRONIC STRUCTURE; INDIUM; MICROSTRUCTURE; SOLID SOLUTIONS; TERNARY SYSTEMS;

ALUMINUM-INDIUM ALLOYS; INTERCONNECTS;

ALUMINUM ALLOYS;

EID: 0034322134     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1394062     Document Type: Article

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