Hydrodynamic effects in the electrodeposition of Au-Cu-Cd alloys: An experimental and numerical study

Transactions of the Institute of Metal Finishing

Volumn 78, Issue 6, 2000, Pages 227-230

  Bozzini, B ^a,b   Cavallotti, P L ^a  

^a UNIVERSITY OF SALENTO   (Italy)

^b POLITECNICO DI MILANO   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; GOLD ALLOYS; HYDRODYNAMICS;

FREE-CYANIDE BATHS; SOFTWARE PACKAGE FLUENT;

ELECTROPLATING;

EID: 0034321066     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1080/00202967.2000.11871346     Document Type: Article

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