Solidification and interfacial structure of in situ Al-4.5Cu/TiB2 composite

Journal of Materials Science

Volumn 35, Issue 22, 2000, Pages 5605-5608

  Chen, Z Y ^a,b   Chen, Y Y ^a   Shu, Q ^a   An, G Y ^a   Li, D ^b   Xu, D S ^b   Liu, Y Y ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COPPER ALLOYS; CRYSTAL ORIENTATION; HIGH RESOLUTION ELECTRON MICROSCOPY; INTERFACES (MATERIALS); MECHANICAL PROPERTIES; MELTING; METAL CASTING; METALLOGRAPHIC MICROSTRUCTURE; NUCLEATION; PARTICLE SIZE ANALYSIS; SOLIDIFICATION; TITANIUM ALLOYS;

ELONGATION; TITANIUM BORIDE;

METALLIC MATRIX COMPOSITES;

EID: 0034318290     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004869400097     Document Type: Article

References (10)

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