Thermoelectroelastic solution for elliptic inclusions and application to crack-inclusion problems

Applied Mathematical Modelling

Volumn 25, Issue 1, 2000, Pages 1-23

  Qin, Qing Hua ^a  

^a UNIVERSITY OF SYDNEY   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

CONFORMAL MAPPING; HEAT TRANSFER; INCLUSIONS; INTEGRAL EQUATIONS; PERTURBATION TECHNIQUES; PIEZOELECTRIC MATERIALS; THERMAL LOAD; THERMOELASTICITY;

PIEZOELECTRIC INCLUSIONS; THERMOELECTROELASTICITY;

FRACTURE MECHANICS;

EID: 0034316621     PISSN: 0307904X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0307-904X(00)00032-9     Document Type: Article

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