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Volumn 23, Issue 4, 2000, Pages 729-736

Visualization analysis of melt flow in IC packaging process along thickness direction

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FLOW VISUALIZATION; GLASS; IMAGE ANALYSIS; INTEGRATED CIRCUIT MANUFACTURE; SURFACE PHENOMENA; THERMOSETS; TRANSFER MOLDING;

EID: 0034314513     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.883765     Document Type: Article
Times cited : (8)

References (9)
  • 1
  • 2
    • 0027813193 scopus 로고
    • Reliability of postmolded IC packages
    • L. T. Nguyen, "Reliability of postmolded IC packages," J. Electron. Packag., vol. 115, pp. 346-355, 1993.
    • (1993) J. Electron. Packag. , vol.115 , pp. 346-355
    • Nguyen, L.T.1
  • 3
    • 0027210331 scopus 로고
    • Reactive flow simulation in transfer molding of IC packages
    • _, "Reactive flow simulation in transfer molding of IC packages," in Proc 43rd Electron. Comp. Technol. Conf., 1993, pp. 375-389.
    • (1993) Proc 43rd Electron. Comp. Technol. Conf. , pp. 375-389
  • 5
    • 0028752505 scopus 로고
    • Computer aided engineering (CAE) for the microelectronic packaging process
    • L. S. Turng, "Computer aided engineering (CAE) for the microelectronic packaging process," Adv. Computer-Aided Eng. (CAE) Polymer Processing, vol. MD-49, pp. 191-208, 1994.
    • (1994) Adv. Computer-aided Eng. (CAE) Polymer Processing , vol.MD-49 , pp. 191-208
    • Turng, L.S.1
  • 6
    • 0029227896 scopus 로고
    • Flow analysis in a cavity with leadframe during semiconductor chip encapsulation
    • S. Han and K. K. Wang, "Flow analysis in a cavity with leadframe during semiconductor chip encapsulation," Adv. Electron. Packag. ASME-EEP, vol. 10-1, pp. 73-80, 1995.
    • (1995) Adv. Electron. Packag. ASME-EEP , vol.10 , Issue.1 , pp. 73-80
    • Han, S.1    Wang, K.K.2
  • 8
    • 0026369053 scopus 로고
    • Mechanical deformation of leadframe assemblies in plastic packages during molding
    • E. Suhir and L. T. Manzione, "Mechanical deformation of leadframe assemblies in plastic packages during molding," J. Electron. Packag., vol. 113, pp. 421-425, 1991.
    • (1991) J. Electron. Packag. , vol.113 , pp. 421-425
    • Suhir, E.1    Manzione, L.T.2
  • 9
    • 0141720565 scopus 로고
    • Direct observation of jetting phenomena under a high injection pressure by using a prismatic-glass inserted mold
    • H. Yokoi, T. Hayashi, K. Toda, and N. Morikita, "Direct observation of jetting phenomena under a high injection pressure by using a prismatic-glass inserted mold," in Proc. Conf. ANTEC'88, 1988, pp. 329-333.
    • (1988) Proc. Conf. ANTEC'88 , pp. 329-333
    • Yokoi, H.1    Hayashi, T.2    Toda, K.3    Morikita, N.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.