Visualization analysis of melt flow in IC packaging process along thickness direction

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 4, 2000, Pages 729-736

  Sato, Masahiro ^a   Yokoi, Hidetoshi ^b  

^a PANASONIC CORPORATION   (Japan)

^b INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FLOW VISUALIZATION; GLASS; IMAGE ANALYSIS; INTEGRATED CIRCUIT MANUFACTURE; SURFACE PHENOMENA; THERMOSETS; TRANSFER MOLDING;

CAVITY FILLING PROCESS; GLASS INSERTED MOLD; HIGH SPEED VIDEO SYSTEM; MELT FRONT BEHAVIOR; VISUALIZATION ANALYSIS;

ELECTRONICS PACKAGING;

EID: 0034314513     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.883765     Document Type: Article

References (9)

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