Evaluation and characterization of reliable non-hermetic conformal coatings for microelectromechanical system (MEMS) device encapsulation

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 4, 2000, Pages 721-728

  Wu, Jiali ^a,b   Pike, Randy T ^b   Wong, C P ^a,b   Kim, Namsoo P ^c   Tanielian, Minas H ^c  

^a IEEE

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c BOEING COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ELASTOMERS; ELECTRIC PROPERTIES; ELECTRIC RESISTANCE MEASUREMENT; ENCAPSULATION; EPOXY RESINS; LEAKAGE CURRENTS; MECHANICAL TESTING; MICROELECTROMECHANICAL DEVICES; SHEAR STRESS; SILICONES; THERMAL CYCLING;

CONFORMAL COATINGS; INTERFACIAL ADHESION; MOBILE ION PERMEATION; MOISTURE INGRESS; PARYLENES; SURFACE INSULATION RESISTANCE; TRIPLE TRACK RESISTANCE;

ORGANIC COATINGS;

EID: 0034314423     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.883764     Document Type: Article

References (12)

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