Computer simulation of thermal contact conductance based on random numbers

JSME International Journal, Series B: Fluids and Thermal Engineering

Volumn 43, Issue 4, 2000, Pages 665-670

  Tomimura, Toshio ^a   Matsuda, Yasuyuki ^a   Zhang, Xing ^a   Fujii, Motoo ^a  

^a KYUSHU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; HEAT CONDUCTION; MATHEMATICAL MODELS; RANDOM NUMBER GENERATION; SURFACE ROUGHNESS; THERMAL CONDUCTIVITY OF SOLIDS; TRIBOLOGY;

THERMAL CONTACT CONDUCTANCE (TCC); THERMAL CONTACT RESISTANCE;

HEAT TRANSFER;

COMPUTER MODELING; HEAT CONDUCTION; SURFACE ROUGHNESS; WAVINESS;

EID: 0034313581     PISSN: 13408054     EISSN: None     Source Type: Journal    
DOI: 10.1299/jsmeb.43.665     Document Type: Article

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