Simulation of micro-channel heat sinks for optoelectronic microsystems

Microelectronics Journal

Volumn 31, Issue 9, 2000, Pages 787-790

  Kreutz, E W ^a   Pirch, N ^b   Ebert, T ^b   Wester, R ^b   Ollier, B ^b   Loosen, P ^b   Poprawe, R ^a,b  

^a RWTH AACHEN UNIVERSITY   (Germany)

^b FRAUNHOFER INSTITUTE FOR LASER TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER; MASS TRANSFER; PRESSURE DROP; SEMICONDUCTOR LASERS; THERMAL LOAD;

MICRO-CHANNEL HEAT SINKS; MICRO-COOLING SYSTEMS;

INTEGRATED OPTOELECTRONICS;

EID: 0034301388     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(00)00060-4     Document Type: Article

References (5)

1. Loosen P., Treusch H.-G., Haas C.R., Gardenier U., Weck M., Sinhoff V., Kasperowski St., vor dem Esche R. SPIE Proc. Ser. 2382:1995;78.
2. T. Ebert, thesis, RWTH Aachen, 1998.
3. Beach R. IEEE J. Quant. Electronics. 28:1992;966.
4. Ebert T., Biesenbach J., Treusch H.-G., Loosen P., Poprawe R. SPIE Proc. Ser. 3097:1997;578.
5. Tuckenbrodt E. Fluidmechanik I. 1980;Springer, Berlin.