Fabrication of Bi-2212 superconductor using Ag/Ni clad tape as low cost substrate

Physica C: Superconductivity and its Applications

Volumn 339, Issue 3, 2000, Pages 209-213

  Nemoto, Y ^a,b,c   Miao, H ^b,c   Fujii, H ^c   Kitaguchi, H ^c   Kumakura, H ^c   Togano, K ^a,b,c   Shima, K ^d  

^a UNIVERSITY OF TSUKUBA   (Japan)

^b JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

^c NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^d TANAKA KIKINZOKU KOGYO K K   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BINDERS; BISMUTH COMPOUNDS; DEFORMATION; DIFFUSION; FABRICATION; HEAT TREATMENT; NICKEL; SILVER; SUBSTRATES; TAPES;

BISMUTH-2212 SUPERCONDUCTORS; CLAD TAPES;

SUPERCONDUCTING MATERIALS;

EID: 0034300959     PISSN: 09214534     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-4534(00)00354-3     Document Type: Article

References (10)

1. Kumakura H., Togano K., Dietderich D.R., Maeda H., Kase J., Morimoto T. IEEE Trans. Magn. MAG. 27:1991;1250.
2. Kase J., Morimoto T., Togano K., Kumakura H., Dietderich D.R., Maeda H. IEEE Trans. Magn. MAG. 27:1991;1254.
3. Hasegawa T., Hikichi Y., Kumakura H., Kitaguchi H., Togano K. Jpn. J. Appl. Phys. 34:1995;L1638.
4. Tenbrink J., Wilhelm M., Heine K., Krauth H. IEEE Trans. Magn. MAG. 27:1991;1239.
5. Okada M., Tanaka K., Wakuda T., Ohata K., Sato J., Kumakura H., Kiyoshi T., Kitaguchi H., Togano K., Wada H. IEEE Trans. Appl. Superconduct. 9:1999;920.
6. Hasegawa T., Hikichi Y., Koizumi T., Ohtani N., Kumakura H., Kitaguchi H., Togano K. IEEE Trans. Appl. Superconduct. 9:1999;948.
7. P. Grant, Proceedings of NATO Advanced Study Institute: Applications of Superconductivity, Loen, Norway, 1997.
8. Meng R.L., Garcia C., Wang Y.Q., Kang W.N., Rusakova I., Chu C.W. Physica C. 306:1998;223.
9. c Superconductors, Yamanashi, Japan, 1999, Physica C, submitted for publication.
10. Kumakura H., Kitaguchi H., Togano K., Sugiyama N. J. Appl. Phys. 80:1996;5162.