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Volumn 35, Issue 19, 2000, Pages 4977-4987

Thermal analysis of copper-tin alloys during rapid solidification

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLING; DATA ACQUISITION; FINITE ELEMENT METHOD; HEAT TRANSFER COEFFICIENTS; LEVITATION MELTING; RAPID SOLIDIFICATION; SPECIFIC HEAT; THERMOANALYSIS;

EID: 0034299237     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004846812384     Document Type: Article
Times cited : (15)

References (34)
  • 24
    • 26644467487 scopus 로고    scopus 로고
    • Femsys Limited
    • Femgv Ver 4.0, Femsys Limited, 1996.
    • (1996) Femgv Ver 4.0
  • 29
    • 26644444800 scopus 로고    scopus 로고
    • R. D. PEHLKE, A. JEYARAJAN, H. WADA, NSF/MEA-82028, NTIS, Michigan Univ., 1982
    • R. D. PEHLKE, A. JEYARAJAN, H. WADA, NSF/MEA-82028, NTIS, Michigan Univ., 1982.
  • 30
    • 26644460426 scopus 로고
    • Royal Inst.of Tech., Stockholm
    • B. SUNDMAN, "Thermoclac" (Royal Inst.of Tech., Stockholm, 1993).
    • (1993) Thermoclac
    • Sundman, B.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.