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Volumn 35, Issue 19, 2000, Pages 4977-4987
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Thermal analysis of copper-tin alloys during rapid solidification
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPUTER SIMULATION;
COOLING;
DATA ACQUISITION;
FINITE ELEMENT METHOD;
HEAT TRANSFER COEFFICIENTS;
LEVITATION MELTING;
RAPID SOLIDIFICATION;
SPECIFIC HEAT;
THERMOANALYSIS;
COOLING CURVES;
MIRROR FURNACES;
COPPER ALLOYS;
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EID: 0034299237
PISSN: 00222461
EISSN: None
Source Type: Journal
DOI: 10.1023/A:1004846812384 Document Type: Article |
Times cited : (15)
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References (34)
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