Thermal etching of alumina

American Ceramic Society Bulletin

Volumn 79, Issue 10, 2000, Pages 83-86

  Chen, R Z ^a   Tuan, W H ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; HEATING; POLISHING; THERMAL EFFECTS;

THERMAL ETCHING;

ALUMINA;

EID: 0034297758     PISSN: 00027812     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (6)

1. R. W. Rice, "Microstructure Dependence of Mechanical Behavior of Ceramics"; pp. 198-381 in Treatise of Material Science and Technology, Vol. 11. Academic Press, New York, 1977.
2. D. J. Clinton, A Guide to Polishing and Etching of Technical and Engineering Ceramics; pp. 19-20. Institute of Ceramics, Stoke-on-Trent, U.K., 1987.
3. E. W. Roberts and P. C. Robinson, "Light Microscopy of Ceramics," J. Microscopy, 140 [2] 137-58 (1985).
4. J. C. Wurst and J. A. Nelson, "Lineal Intercept Technique for Measuring Grain Size in Two-Phase Polycrystalline Ceramics," J. Am. Ceram. Soc., 55 [2] 109 (1972).
5. R. J. Brook, "Controlled Grain Growth"; pp. 331-64 in Treatise of Material Science and Technology, Vol. 9. Edited by F. F. Y. Wang. Academic Press, New York, 1976.
6. T. S. Owate and R. Freer, "Thermochemical Etching Method for Ceramics," J. Am. Ceram. Soc., 75 [5] 1266-68 (1992).