-
1
-
-
0020919219
-
Fourier transform profilometry for the automatic measurement of 3-D object shapes
-
M. Takeda and K. Mutoh, "Fourier transform profilometry for the automatic measurement of 3-D object shapes," Appl. Opt. 22, 3977-3982 (1983).
-
(1983)
Appl. Opt.
, vol.22
, pp. 3977-3982
-
-
Takeda, M.1
Mutoh, K.2
-
2
-
-
0002562479
-
Spatial-carrier fringe-pattern analysis and its applications to precision interferometry and profilometry: An overview
-
M. Takeda, "Spatial-carrier fringe-pattern analysis and its applications to precision interferometry and profilometry: an overview," Indus. Metrol. 1, 79-99 (1990).
-
(1990)
Indus. Metrol.
, vol.1
, pp. 79-99
-
-
Takeda, M.1
-
3
-
-
0001437776
-
Application of moiré analysis of strain using Fourier transform
-
Y. Morimoto and Y. Seguchi, "Application of moiré analysis of strain using Fourier transform," Opt. Eng. 27(8), 650-656 (1988).
-
(1988)
Opt. Eng.
, vol.27
, Issue.8
, pp. 650-656
-
-
Morimoto, Y.1
Seguchi, Y.2
-
4
-
-
0024905442
-
Two-dimensional moiré method and grid method using Fourier transform
-
Y. Morimoto, Y. Seguchi, and T. Higashi, "Two-dimensional moiré method and grid method using Fourier transform," Exp. Mech. 29(4), 399-404 (1989).
-
(1989)
Exp. Mech.
, vol.29
, Issue.4
, pp. 399-404
-
-
Morimoto, Y.1
Seguchi, Y.2
Higashi, T.3
-
5
-
-
0002806213
-
Analysis of the thermal loading on electronics packages by enhanced moiré interferometry
-
Chap. 8 John H. Lau, Ed., Van Nostrand Reinhold, New York
-
A. Voloshin, "Analysis of the thermal loading on electronics packages by enhanced moiré interferometry," Chap. 8 in Thermal Stress and Strain in Microelectronics Packaging, John H. Lau, Ed., pp. 272-304, Van Nostrand Reinhold, New York (1993).
-
(1993)
Thermal Stress and Strain in Microelectronics Packaging
, pp. 272-304
-
-
Voloshin, A.1
-
6
-
-
0033326818
-
Grid method for strain measurement in electronic packaging using optical, electronic microscope, and atomic force microscope
-
B. Zhao, A. Asundi, and K. E. Oh, "Grid method for strain measurement in electronic packaging using optical, electronic microscope, and atomic force microscope," in International Symposium on Photonics and Applications - ISPA '99, Proc. SPIE 3897, 260-271 (1999).
-
(1999)
International Symposium on Photonics and Applications - ISPA '99, Proc. SPIE
, vol.3897
, pp. 260-271
-
-
Zhao, B.1
Asundi, A.2
Oh, K.E.3
-
7
-
-
0001437776
-
Application of moiré analysis of strain using Fourier transform
-
Y. Morimoto and Y. Seguchi, "Application of moiré analysis of strain using Fourier transform," Opt. Eng. 27(8), 650-656 (1988).
-
(1988)
Opt. Eng.
, vol.27
, Issue.8
, pp. 650-656
-
-
Morimoto, Y.1
Seguchi, Y.2
-
8
-
-
0024905442
-
Two-dimensional moiré method and grid method using Fourier transform
-
Y. Morimoto, Y. Seguchi, and T. Higashi, "Two-dimensional moiré method and grid method using Fourier transform," Exp. Mech. 29(4), 399-404 (1989).
-
(1989)
Exp. Mech.
, vol.29
, Issue.4
, pp. 399-404
-
-
Morimoto, Y.1
Seguchi, Y.2
Higashi, T.3
-
9
-
-
0027813024
-
Computer aided evaluation of fringe patterns
-
T. M. Kreis, "Computer aided evaluation of fringe patterns," Opt. Lasers Eng. 19(4-5), 221-240 (1993).
-
(1993)
Opt. Lasers Eng.
, vol.19
, Issue.4-5
, pp. 221-240
-
-
Kreis, T.M.1
-
10
-
-
0342804494
-
-
Private Communication, National Metrology Institute, CNAM, Paris, France
-
Y. Surrel, Private Communication, National Metrology Institute, CNAM, Paris, France.
-
-
-
Surrel, Y.1
-
13
-
-
0032651128
-
Error caused by sampling in Fourier transform profilometry
-
W. Chen, H. Yang, X. Su, and S. Tan, "Error caused by sampling in Fourier transform profilometry," Opt. Eng. 38(6), 1029-1034 (1999).
-
(1999)
Opt. Eng.
, vol.38
, Issue.6
, pp. 1029-1034
-
-
Chen, W.1
Yang, H.2
Su, X.3
Tan, S.4
|