Diffusion coefficients of Cu(II) complexes with ligands used in alkaline electroless copper plating solutions

Journal of Applied Electrochemistry

Volumn 30, Issue 10, 2000, Pages 1163-1168

  Norkus, E ^a  

^a CENTER FOR PHYSICAL SCIENCES AND TECHNOLOGY   (Lithuania)

Author keywords

[No Author keywords available]

Indexed keywords

ACETIC ACID; COPPER COMPOUNDS; DIFFUSION; GLYCEROL; ORGANOMETALLICS; POLAROGRAPHIC ANALYSIS;

LIGANDS; SACCHAROSE; TARTARIC ACID;

ELECTROLESS PLATING;

EID: 0034292610     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004089915476     Document Type: Article

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