Curing kinetics and viscosity change of a two-part epoxy resin during mold filling in resin-transfer molding process

Journal of Applied Polymer Science

Volumn 77, Issue 10, 2000, Pages 2139-2148

  Lee, Chang Lun ^a   Wei, Kung Hwa ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSIS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DIFFUSION; MATHEMATICAL MODELS; POLYAMIDES; REACTION KINETICS; TEMPERATURE; TRANSFER MOLDING; VISCOSITY;

AMINE RESIN; AUTOCATALYTIC; DIFFUSION CONTROL EFFECT; MOLD FILLING; RESIN TRANSFER MOLDING;

EPOXY RESINS;

EID: 0034274940     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/1097-4628(20000906)77:10<2139::AID-APP6>3.0.CO;2-N     Document Type: Article

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