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Volumn 35, Issue 18, 2000, Pages 4557-4561
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Microstructural and mechanical stability of Cu-6 wt. % Ag alloy
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Author keywords
[No Author keywords available]
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Indexed keywords
AGING OF MATERIALS;
DIMENSIONAL STABILITY;
ELECTRIC CONDUCTIVITY OF SOLIDS;
FRACTURE TOUGHNESS;
METALLOGRAPHIC MICROSTRUCTURE;
STRAIN RATE;
STRESS ANALYSIS;
THERMOMECHANICAL TREATMENT;
COPPER SILVER ALLOYS;
COPPER ALLOYS;
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EID: 0034271663
PISSN: 00222461
EISSN: None
Source Type: Journal
DOI: 10.1023/A:1004876806313 Document Type: Article |
Times cited : (32)
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References (18)
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