Design of compression shrink-fit ceramic-steel wear ring assembly for chemical mechanical planarization

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 18, Issue 5, 2000, Pages 2597-2602

  Lougher, Wayne ^a   Vondra, Lawrence ^a  

^a SpeedFam IPEC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); BRITTLENESS; CERAMIC MATERIALS; COMPRESSIVE STRENGTH; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MATHEMATICAL MODELS; METALS; STRESS ANALYSIS; THERMAL EXPANSION;

CHEMICAL MECHANICAL PLANARIZATION; COMPRESSION FITTING; INTERFACIAL REACTIONS;

SHRINKFITTING;

EID: 0034264896     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1312264     Document Type: Article

References (9)

1. D. W. Richerson, Modern Ceramic Engineering, 2nd ed. (1992), p. 171.
2. Mechanical & Industrial Ceramics, publication No. 002/001/9809, Kyocera Corporation, 1998, pp. 25 and 26.
3. P. Cuddyer, Kyocera Corporation (private communication, 1999).
4. Handbook of Chemistry and Physics, 61st ed. p. F-163; J. B. Wachtman, Mechanical Properties of Ceramics (Wiley, New York, 1996), p. 101.
5. Handbook of Chemistry and Physics, 61st ed. p. F-163; J. B. Wachtman, Mechanical Properties of Ceramics (Wiley, New York, 1996), p. 101.
6. W. C. Young, Roark's Formulas for Stress & Strain, 6th ed. (McGraw-Hill, New York, 1989), p. 27.
7. R. D. Cook and W. C. Young, Advanced Mechanics of Materials (Mac-Millan, New York, 1985), p. 22.
8. In Ref. 6, p. 21.
9. ASM Metals Handbook, desk ed. (1985), pp. 1-67.