Three-dimensional microanalysis of the wire-pad contact region of integrated circuits

Surface and Interface Analysis

Volumn 29, Issue 8, 2000, Pages 508-513

  Wu, H ^a,b   Takanashi, K ^a   Ono, N ^a   Cheng, Zh H ^a   Sakamoto, T ^c   Sakou, T ^b   Owari, M ^a,c   Nihei, Y ^a  

^a INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

^b SUMITOMO METAL MINING CO LTD   (Japan)

^c UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; INTEGRATED CIRCUITS; INTERFACES (MATERIALS); ION BEAMS; MICROANALYSIS; MICROELECTRONICS; PARTICLE DETECTORS;

WIRE BONDING;

SURFACE CHEMISTRY;

EID: 0034250088     PISSN: 01422421     EISSN: None     Source Type: Journal    
DOI: 10.1002/1096-9918(200008)29:8<508::AID-SIA894>3.0.CO;2-I     Document Type: Article

References (8)

1. Kato H. Jpn. J. Appl. Phys. 1986; 25: 934.
2. Kato H. Jpn. J. Appl. Phys. 1987; 26: 1786.
3. Haji H, Miyoshi K, Morita T, Nakashima H, Yoshinaga H. J. Jpn. Inst. Met. 1992; 56: 355.
4. Uno T, Tatsumi K. 5th Symposium on Microjoining and Assembly Technology in Electronics, Yokohama, Japan, 1999; 25-30.
5. Owari M, Sakamoto T, Cheng ZhH, Takhashi M, Nihei Y. In ECASIA 97: 7th European Conference on Applications of Surface and Interface Analysis, Olefjord I, Nyborg L, Briggs D (eds). Wiley: Chichester, 1997; 1085-1088.
6. Takanashi T, Wu H, Kuramoto Y, Cheng ZhH, Sakamoto T, Owari M, Nihei Y. Surf. Interface Anal. in press.
7. Satoh H, Owari M, Nihei Y. J. Vac. Sci. Technol. B 1988; 6: 915.
8. Owari M, Sakamoto T, Takahashi M, Cheng ZhH, Kuramoto Y, Nihei Y. J. Surf. Anal. 1999; 5: 356.