Recording of elevated temperature fatigue crack growth data by DCPD system

High Temperature Materials and Processes

Volumn 19, Issue 5, 2000, Pages 367-370

  Ramachandran, N ^a   Arakere, N ^b   Goswami, T ^c  

^a CESSNA AIRCRAFT COMPANY   (United States)

^b UNIVERSITY OF FLORIDA   (United States)

^c Wichita State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; ERROR ANALYSIS; FATIGUE OF MATERIALS; STRESS ANALYSIS; STRESS INTENSITY FACTORS; TENSILE STRENGTH;

DIRECT CURRENT POTENTIAL DIFFERENCE (DCPD) METHOD;

METALLIC COMPOUNDS;

EID: 0034248462     PISSN: 03346455     EISSN: None     Source Type: Journal    
DOI: 10.1515/HTMP.2000.19.5.357     Document Type: Article

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