Analytical approach to temperature evaluation in bonding wires and calculation of allowable current

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 3, 2000, Pages 426-435

  Nöbauer, Gerhard T ^a   Moser, Herwig ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Current; Cylindrical system; Heat equation; Molding compound; Periodic heating; Transient heat conduction; Wirebonding

Indexed keywords

CERAMIC MATERIALS; DIFFERENTIAL EQUATIONS; ELECTRIC CURRENTS; ELECTRIC RESISTANCE; ELECTRIC WIRE; ENCAPSULATION; HEAT CONDUCTION; HEAT CONVECTION; HEAT RADIATION; MATHEMATICAL MODELS; PLASTIC MOLDS; THERMAL CONDUCTIVITY OF SOLIDS;

BONDING WIRE; CERAMIC PACKAGES; HEAT DIFFUSION EQUATION; MOLDING COMPOUND; PERIODIC HEATING;

ELECTRONICS PACKAGING;

EID: 0034238612     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.861557     Document Type: Article

References (9)

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