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Volumn 18, Issue 4 I, 2000, Pages 1230-1233
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New approach for the fabrication of device-quality Ge/GeO2/SiO2 interfaces using low temperature remote plasma processing
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Author keywords
[No Author keywords available]
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Indexed keywords
CURRENT VOLTAGE CHARACTERISTICS;
GERMANIUM;
INTERFACES (MATERIALS);
OXIDATION;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
SILICA;
REMOTE PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
MOS CAPACITORS;
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EID: 0034229639
PISSN: 07342101
EISSN: None
Source Type: Journal
DOI: 10.1116/1.582331 Document Type: Article |
Times cited : (47)
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References (15)
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