Research concerning the separation and recovery of used printed wiring board solder

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 23, Issue 3, 2000, Pages 214-218

  Yamagiwa, Yasuyuki ^a   Soyama, Shinichi ^b   Iwata, Shuichi ^c  

^a SONY CORPORATION   (Japan)

^b Wind Power Department   (Japan)

^c UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL PROTECTION; LEAD; RECYCLING; SOLDERING ALLOYS;

LEAD-FREE SOLDERS;

PRINTED CIRCUIT BOARDS;

EID: 0034223260     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.873250     Document Type: Article

References (5)

1. Y. Miyazawa and T. Ariga Microstructural change and hardness of lead-free solder alloys," in Proc. 1st the Int. Symp. Environ. Conscious Design Inverse, 1999, 616.
2. T. Takemoto Shift toward lead-free micro-soldering," in Proc. EcoDesign '99Jpn. Symp., 1999, 46.
3. T. Takemoto, H. Tadauchi, I. Komatsu, K. Tejima, S. Nakamura, and M. Tomita Technology concerning lead-free solder containing Zinc," in Proc. EcoDesign '99 Jpn. Symp., 1999, 268.
4. S. Yokoyama and M. Iji Recycling of printed wiring boards with mounted electronic parts," in Proc. 1997 IEEE Int. Symp. Electron. Environ., 1997, 109.
5. S. Soyama and Y Iwata Studies on separating solder from waste printed wiring boards," in Proc. Ist ECEE Symp. Electron. Environ., 1996, 79.