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Volumn 17, Issue 6, 2000, Pages 20-26+28+30+32
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Sensors that can take the heat, Part 1: Opening the high-temperature toolbox
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
CMOS INTEGRATED CIRCUITS;
ELECTRIC BREAKDOWN;
ELECTRONICS INDUSTRY;
HIGH TEMPERATURE APPLICATIONS;
HIGH TEMPERATURE OPERATIONS;
INSTRUMENT COMPONENTS;
INTEGRATED CIRCUIT LAYOUT;
LEAKAGE CURRENTS;
PERFORMANCE;
PROCESS CONTROL;
PRODUCT DEVELOPMENT;
SILICON ON INSULATOR TECHNOLOGY;
BOLTZMANN CONSTANT;
COMMERCIAL OFF-THE-SHELF ELECTRONICS;
DOPING DENSITY;
HIGH TEMPERATURE TOLERANT ELECTRONICS;
INTRINSIC CARRIER DENSITY;
PARASITIC CURRENT TRANSFER;
THERMAL CYCLES;
THERMAL WEAROUT;
SENSORS;
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EID: 0034211184
PISSN: 07469462
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
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Times cited : (10)
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References (0)
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