Resist heating with different writing strategies for high-throughput maskmaking

Microelectronic Engineering

Volumn 53, Issue 1, 2000, Pages 341-344

  Babin, Sergey ^a  

^a Etec Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COMPUTER SOFTWARE; CURRENT DENSITY; INTEGRATED CIRCUIT MANUFACTURE; MASKS; PHOTORESISTS; THERMAL EFFECTS;

HIGH THROUGHPUT MASKMAKING; RESIST HEATING; SOFTWARE PACKAGE TEMPTATION;

ELECTRON BEAM LITHOGRAPHY;

EID: 0034207066     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(00)00329-4     Document Type: Article

References (4)

1. 1. E. Kratschmer and T. Groves, J. Vac. Sci. Technol., B8(6), p. 1898, 1990.
2. 2. S. Babin, J. Vac. Sci. Technol., B15(6), p. 2209, 1997.
3. 3. S. Babin, I. Kuzmin, J. Vac. Sci. Technol, B(16) 6, p. 3241, 1998.
4. 4. M. Gesley, T. Mulera, C. Nurmi, J. Radley, A. Sagle, K. Standiford, Z. Tan, J. Thomas, and L. Veneklasen, Proc. SPIE, 2437, p. 168, 1995.