High density interconnect multi-chip module for the front-end electronics of the PHENIX/MVD

IEEE Transactions on Nuclear Science

Volumn 47, Issue 3 PART 2, 2000, Pages 802-805

  Hahn, S F ^a   Sullivan, J P ^a  

^a LOS ALAMOS NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; INTERCONNECTION NETWORKS; NUCLEAR PHYSICS; SILICON SENSORS; SUBSTRATES; THIN FILMS;

FRONTEND ELECTRONICS; HIGH DENSITY INTERCONNECT; MULTIPLICITY VECTOR DETECTOR;

MULTICHIP MODULES;

EID: 0034206606     PISSN: 00189499     EISSN: None     Source Type: Journal    
DOI: 10.1109/23.856520     Document Type: Article

References (3)

1. C. L. Britton, Jr. , et al, TGV32: A 32-Channel Preamplifier Chip for the Multiplicity Vertex Detector at PHENIX", Review of Scientific Instruments, Vol. 70, No. 3, pp. 1684-1687, March 1999.
2. C. L. Britton, Jr. et al. , "Design and Performance of Beam Test Electronics for the PHENIX Multiplicity Vertex Detector", IEEE Trans. Nucl, Sei. , Vol. 44, No. 3, pp. 283288, June 1997
3. M. S. Emery, et al. , "A Multi-Channel ADC for Use in the PHENIX Detector", IEEE Trans. Nucl. Sei. , Vol. 44, No. 3, pp. 374-378, June 1997