Microstructures etched in doped TMAH solutions

Microelectronic Engineering

Volumn 53, Issue 1, 2000, Pages 547-551

  Brida, S ^a   Faes, A ^b   Guarnieri, V ^a   Giacomozzi, F ^a   Margesin, B ^a   Paranjape, M ^c   Pignatel, G U ^b   Zen, M ^a  

^a ITC IRST   (Italy)

^b UNIVERSITY OF TRENTO   (Italy)

^c GEORGETOWN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ALUMINUM CORROSION; AMMONIUM COMPOUNDS; ETCHING; INORGANIC ACIDS; MICROELECTROMECHANICAL DEVICES; PASSIVATION; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DOPING; SURFACE ROUGHNESS;

ANISOTROPIC SILICON ETCHANT; MECHANICAL MICROSTRUCTURES; MICROELECTROMECHANICAL STRUCTURES AND SYSTEMS; TETRAMETHYL AMMONIUM HYDROXIDE;

MICROELECTRONIC PROCESSING;

EID: 0034206095     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(00)00375-0     Document Type: Article

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