Three-dimensional microstructure elements fabricated by electron beam lithography and dry etching technique

Microelectronic Engineering

Volumn 53, Issue 1, 2000, Pages 539-542

  Steingruber R ^a   Ferstl, M ^a  

^a FRAUNHOFER HEINRICH HERTZ INSTITUTE   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DRY ETCHING; ELECTRON BEAM LITHOGRAPHY; MICROELECTROMECHANICAL DEVICES; MICROOPTICS; PHOTORESISTS; REACTIVE ION ETCHING; THREE DIMENSIONAL;

THREE DIMENSIONAL MICROSTRUCTURE ELEMENT; THREE DIMENSIONAL OPTICAL STRUCTURES;

MICROELECTRONIC PROCESSING;

EID: 0034205479     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(00)00373-7     Document Type: Article

References (6)

1. [1] M. Ferstl, Reactive ion etching: A versatile fabrication technique for micro-optical elements, OSA Tech. Digest Series, Vol. 10, pp 167-169, 1998
2. [2] S. Sinzinger, J. Jahns (eds.), Microoptics, Weinheim, New York. p. 155, 1999
3. [3] H. Engel, J. Wengelink, R. Steingrüber, Application of smoothing techniques to relief-type resist surfaces generated by direct write electron-beam lithography, Procceedings of the SPIE, Vol. 2437-37, pp. 397-401
4. [4] J. Wengelink, Photolithographie Mit Semitransparenten Masken, Doctor thesis Universität Ulm, 1996
5. [5] S. Ullerich, Herstellung von Wellenleitertapern Mit Hilfe von Semitransparenten Photomasken für die Anwendung in Wellenleiter-integrierten Photodioden auf InP-Basis, Diploma thesis, Technische Universität Berlin, Oct. 1997
6. [6] P. Trefonas III et al., Examination of the mechanism of the post exposure bake effect, Proc. of SPIE 920, pp 203-211, 1988