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Volumn 49, Issue 2, 2000, Pages 136-146

On thermodynamic reliability engineering

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ENTROPY; FREE ENERGY; MATHEMATICAL MODELS; MICROELECTRONICS; THERMAL DIFFUSION; THERMODYNAMICS;

EID: 0034197705     PISSN: 00189529     EISSN: None     Source Type: Journal    
DOI: 10.1109/TR.2000.877330     Document Type: Article
Times cited : (27)

References (13)
  • 2
    • 0029540498 scopus 로고    scopus 로고
    • "Aspects of the thermodynamic aging process in reliability physics," vol. 49, May 1995.
    • _, "Aspects of the thermodynamic aging process in reliability physics," Inst. Environmental Sciences Proc., vol. 49, May 1995.
    • Inst. Environmental Sciences Proc.
  • 3
    • 33749912521 scopus 로고    scopus 로고
    • "Cumulative damage in fatigue," vol. 12, pp. A159-A164, 1945.
    • M. A. Minor, "Cumulative damage in fatigue," J. Applied Mechanics, vol. 12, pp. A159-A164, 1945.
    • J. Applied Mechanics
    • Minor, M.A.1
  • 6
    • 0022605808 scopus 로고    scopus 로고
    • "Comprehensive model for humidity testing correlation," in 1986, pp. 44-50.
    • D. S. Peck, "Comprehensive model for humidity testing correlation," in Proc. Int'l. Reliability Physics Symp., 1986, pp. 44-50.
    • Proc. Int'l. Reliability Physics Symp.
    • Peck, D.S.1
  • 7
    • 0026155159 scopus 로고    scopus 로고
    • "Recent humidity accelerations, A base for testing standards," vol. 7, pp. 169-180, 1991.
    • O. Hallberg and D. Peck, "Recent humidity accelerations, A base for testing standards," Quality and Reliability Engineering Int'l., vol. 7, pp. 169-180, 1991.
    • Quality and Reliability Engineering Int'l.
    • Hallberg, O.1    Peck, D.2
  • 9
    • 0030106350 scopus 로고    scopus 로고
    • "Connecting parametric aging to catastrophic failure through thermodynamics," vol. 45, p. 28, Mar. 1996.
    • A. A. Feinberg and A. Widom, "Connecting parametric aging to catastrophic failure through thermodynamics," IEEE Trans. Reliability, vol. 45, p. 28, Mar. 1996.
    • IEEE Trans. Reliability
    • Feinberg, A.A.1    Widom, A.2
  • 11
    • 0030313774 scopus 로고    scopus 로고
    • "Modeling creep using a thermodynamic TAT model in reliability physics," vol. 50, May 1996.
    • A. A. Feinberg, "Modeling creep using a thermodynamic TAT model in reliability physics," Proc. Inst. Environmental Sciences, vol. 50, May 1996.
    • Proc. Inst. Environmental Sciences
    • Feinberg, A.A.1
  • 12
    • 33749876532 scopus 로고    scopus 로고
    • "Modeling and understanding junction temperature dependent leakage degradation," in 1998, pp. 197-202.
    • A. A. Feinberg, P. Ersland, and V. Kaper, "Modeling and understanding junction temperature dependent leakage degradation," in Proc. AMP M/A-COM Engineering Conf., Oct. 1998, pp. 197-202.
    • Proc. AMP M/A-COM Engineering Conf., Oct.
    • Feinberg, A.A.1    Ersland, P.2    Kaper, V.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.