Crack patterns in brittle thin films

International Journal of Fracture

Volumn 103, Issue 1, 2000, Pages 1-17

  Shenoy, V B ^a   Schwartzman, A F ^a   Freund, L B ^a  

^a Brown University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE FRACTURE; CRACK PROPAGATION; ELASTICITY; INTERFACES (MATERIALS); RESIDUAL STRESSES; STRESS INTENSITY FACTORS; SUBSTRATES; TENSILE STRESS; THIN FILMS;

BRITTLE THIN FILMS;

FRACTURE MECHANICS;

BRITTLE FRACTURE; CORROSION; CRACK; ELASTIC PROPERTY; FILM;

EID: 0034189967     PISSN: 03769429     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1007673320058     Document Type: Article

References (13)

1. Cracking of thin bonded films in residual tension
2. Edge-bonded orthogonal elastic wedges
3. On the numerical solution of singular integral equations
4. The mechanics of dislocations in strained-layer semiconductor-materials
5. Spiral cracking around a strained cylindrical inclusion in a brittle material and implications for vias in integrated circuits
6. Mixed mode cracking in layered materials
7. Growth of group III nitrides on Si(111) by plasma-assisted molecular beam epitaxy
8. Singularities interacting with interfaces and cracks
9. Crack spacing in brittle films on elastic substrates
10. Modeling the development and relaxation of stresses in films
11. Cracking of brittle films on elastic substrates
12. Crack point singularities at a bimaterial interface